NTB30N20
Power MOSFET
30 Amps, 200 Volts
N?Channel Enhancement?Mode D 2 PAK
Features
? Source?to?Drain Diode Recovery Time Comparable to a Discrete
http://onsemi.com
?
?
?
?
Fast Recovery Diode
Avalanche Energy Specified
I DSS and R DS(on) Specified at Elevated Temperature
Mounting Information Provided for the D 2 PAK Package
Pb?Free Packages are Available
V DSS
200 V
R DS(ON) TYP
68 m W @ V GS = 10 V
N?Channel
D
I D MAX
30 A
Typical Applications
? PWM Motor Controls
? Power Supplies
? Converters
G
S
MAXIMUM RATINGS (T C = 25 ° C unless otherwise noted)
Rating
Drain?to?Source Voltage
Drain?to?Source Voltage (R GS = 1.0 M W )
Symbol
V DSS
V DGR
Value
200
200
Unit
Vdc
Vdc
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
Gate?to?Source Voltage
? Continuous
? Non?Repetitive (t p v 10 ms)
V GS
V GSM
" 30
" 40
Vdc
1
2
4
30N20G
Drain Current ? Continuous @ T A 25 ° C
? Continuous @ T A 100 ° C
? Pulsed (Note 2)
Total Power Dissipation @ T A = 25 ° C
Derate above 25 ° C
Total Power Dissipation @ T A = 25 ° C (Note 1)
I D
I D
I DM
P D
P D
30
22
90
214
1.43
2.0
Adc
W
W/ ° C
W
3
D 2 PAK
CASE 418B
STYLE 2
1
Gate
AYWW
2
Drain
3
Source
Operating and Storage Temperature Range
Single Drain?to?Source Avalanche Energy,
Starting T J = 25 ° C
(V DD = 100 Vdc, V GS = 10 Vdc,
I L (pk) = 20 A, L = 3.0 mH, R G = 25 W )
T J , T stg
E AS
?55 to
+175
450
° C
mJ
30N20
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb?Free Package
Thermal Resistance
° C/W
ORDERING INFORMATION
? Junction?to?Case
? Junction?to?Ambient
? Junction?to?Ambient (Note 1)
R q JC
R q JA
R q JA
0.7
62.5
50
Device
NTB30N20
Package
D 2 PAK
Shipping ?
50 Units/Rail
Maximum Lead Temperature for Soldering
T L
260
° C
NTB30N20G
D 2 PAK
50 Units/Rail
Purposes for 10 seconds
(Pb?Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
NTB30N20T4
NTB30N20T4G
D 2 PAK
D 2 PAK
(Pb?Free)
800 Tape & Reel
800 Tape & Reel
reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in 2 ).
2. Pulse Test: Pulse Width = 10 m s, Duty Cycle = 2%.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2005
August, 2005 ? Rev. 4
1
Publication Order Number:
NTB30N20/D
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